Patent Assignment
Reel/Frame 065678/0602
Assignment of Assignor's Interest
Recorded: 2023-11-27
Pages: 2
Assignor
LEE, SEONG JU
Executed: 2023-11-21
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Buffer Chip, and Semiconductor Package Including Buffer Chip and Memory Chips