IP Library Assignment 065761/0201
Patent Assignment
Reel/Frame 065761/0201

Assignment of Assignor's Interest

Recorded: 2023-12-05 Pages: 4
Assignors
WADA, MASAYUKI
Executed: 2023-08-28
KUMAKI, TAKASHI
Executed: 2023-08-28
MIYAMOTO, YUKI
Executed: 2023-08-28
SAKAMOTO, KEIICHI
Executed: 2023-08-29
SATO, SHUN
Executed: 2023-08-29
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Adhesive Set, Film, Bonded Body, and Method for Separating Adherend
Application: 17/926,385 →
Publication: US 2023/0235205
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →