Patent Assignment
Reel/Frame 065796/0182
Assignment of Assignor's Interest
Recorded: 2023-12-07
Pages: 2
Assignor
OWAKI, HIROFUMI
Executed: 2023-04-12
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Sensor Module