IP Library Granted Patent US 12,422,284
Granted Patent B2
US 12,422,284 · App. 18/039,199 · Granted Sep 23, 2025

Sensor module

Inventor: Hirofumi Owaki (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
G01D11/245B29C65/1635
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Quick Facts
Patent No.
US 12,422,284
App. No.
18/039,199
Granted
Sep 23, 2025
Kind
B2
Abstract

[Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components. [Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a synthetic resin material that has absorptive properties with respect to first laser light. The second member is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light. The third member is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member.

Claims (33)

1. A sensor module, comprising:

a first member that is made of a synthetic resin material that has absorptive properties with respect to first laser light;

a second member that is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light;

a third member that is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member; and

a sensor element that is accommodated between the first member and the second member.

2. The sensor module according to claim 1 , wherein

the first welding portion is provided along a peripheral edge of the first surface, and

the second welding portion is provided along a peripheral edge of the second surface.

3. The sensor module according to claim 2 , wherein

the first welding portion is continuously provided along the peripheral edge of the first surface, or

the second welding portion is continuously provided along the peripheral edge of the second surface.

4. The sensor module according to claim 2 , wherein

the first welding portion is partially provided along the peripheral edge of the first surface, or

the second welding portion is partially provided along the peripheral edge of the second surface.

5. The sensor module according to claim 1 , wherein

the first member is a front case that accommodates therein the sensor element,

the second member is a harness that includes a cable that is electrically connected to the sensor element, and

the third member is a rear case that is connected between the front case and the harness.

6. The sensor module according to claim 1 , wherein

the first member is a front case that accommodates therein the sensor element,

the second member is a bracket used to fix the front case to a vehicle body, and

the third member is a rear case that is connected between the front case and the bracket.

7. The sensor module according to claim 1 , wherein

the third member is a front case that accommodates therein the sensor element, the front case including an opening at an end of the front case, and a through hole that is situated opposite to the end,

the first member is a rear case that is joined to the opening, and

the second member is a translucent protection cover that covers the through hole.

8. The sensor module according to claim 1 , wherein

the sensor element is an imaging device.

9. The sensor module according to claim 1 , wherein

the sensor element is a ranging sensor.

10. The sensor module according to claim 1 , wherein

the first laser light is laser light of a wavelength in an infrared band, and

the second laser light is laser light of a wavelength in a green band.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2023
From: OWAKI, HIROFUMI
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 065796/0182 →
Priority Claims (1)
JP 2020-202080 · Dec 4, 2020 · national
Continuity (1)
Related Publication 20240027236A1 · Jan 25, 2024
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