Patent Assignment
Reel/Frame 065807/0640
Assignment of Assignor's Interest
Recorded: 2023-12-08
Pages: 7
Assignors
NISHIMORI, HITOSHI
Executed: 2023-11-27
HORIUCHI, KEISUKE
Executed: 2023-11-24
NAKAZATO, NORIO
Executed: 2023-11-22
KAWASE, DAISUKE
Executed: 2023-11-30
SASAKI, KOJI
Executed: 2023-11-22
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, JAPAN
Covered Property
(1)
Power Semiconductor Module
Application:
18/566,691 →
Publication:
US 2024/0145331
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.