IP Library › Assignment 065835/0197
Patent Assignment
Reel/Frame 065835/0197

Assignment of Assignor's Interest

Recorded: 2023-12-04 Pages: 8
Assignor
BOSTON PROCESS TECHNOLOGIES, INC.
Executed: 2023-10-31
Assignee
SHARPACK TECHNOLOGY PTE. LTD.
362 UPPER PAYA LEBAR ROAD #03-08, DA JIN FACTORY BUILDING, SINGAPORE, 534963, SINGAPORE
Covered Properties (4)
Hot Wall Flux Free Solder Ball Treatment Arrangement
Application: 15/998,295 →
Publication: US 2020/0043759
Flux-free solder ball mount arrangement
Application: 15/998,298 →
Publication: US 2019/0043745
Multiple module chip manufacturing arrangement
Application: 16/602,396 →
Publication: US 2021/0098401
Fluxless gang die bonding arrangement
Application: 16/873,779 →
Publication: US 2022/0005720
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 1, 2018
From: ZHANG, JIAN
To: BOSTON PROCESS TECHNOLOGIES, INC
Reel/Frame 046775/0708 →
Assignment of Assignor's Interest Aug 1, 2018
From: ZHANG, JIAN
To: BOSTON PROCESS TECHNOLOGIES, INC
Reel/Frame 046775/0753 →
Assignment of Assignor's Interest Oct 30, 2023
From: ZHANG, JIAN
To: BOSTON PROCESS TECHNOLOGIES, INC.
Reel/Frame 065389/0319 →
Assignment of Assignor's Interest Nov 1, 2023
From: BOSTON PROCESS TECHNOLOGIES, INC.
To: SHARPACK TECHNOLOGY PTE. LTD
Reel/Frame 065419/0112 →