Fluxless gang die bonding arrangement

1. A system for the simultaneous assembly of multiple die chip onto a receiver substrate, the system comprising:

a donor chuck configured for supporting a plurality of die chip;

a receiver chuck configured for supporting the receiver substrate;

a pick and place gripper mechanism configured for retrieving each of the plurality of die chips from the donor chuck;

a gang carrier configured for receiving each of the plurality of die chips from the pick and place gripper mechanism and supporting the plurality of die chips;

a flipper mechanism configured for simultaneously delivering the plurality of die chips received by the gang carrier, to a deposition position on the receiver substrate, in an inverted orientation relative to the orientation when received by the gang carrier from the pick and place gripper mechanism; and

a plurality of interconnected inspection cameras controlled by a computer controller, said plurality of interconnected inspection cameras configured to ensure accurate alignment of the plurality of die chips with respect to the deposition position of the receiver substrate;

wherein the gang carrier has a thermocouple-controlled heating element therein to maintain a proper computer-controlled temperature therewithin.

2. The system as recited in claim 1 , wherein the gang carrier is configured for receiving a plurality of die chips having different sizes.

3. The system as recited in claim 1 , wherein the gang carrier includes a first channel configured for introducing a formic acid and nitrogen gas mixture around the plurality of die chips received by the gang carrier to remove surface oxides, and to create a low oxygen die chip environment within the gang carrier.

4. The system as recited in claim 1 , wherein the gang carrier is configured to support a longitudinal array of the plurality of die chips thereon.

5. The system as recited in claim 1 , wherein the gang carrier includes a vacuum channel arrangement within the gang carrier configured for holding securely the plurality of die chips received from the pick and place gripper mechanism.

6. The system as recited in claim 3 , wherein the gang carrier includes a second channel configured for introducing nitrogen around the thermocouple-controlled heating element and the plurality of die chips received from the pick and place gripper mechanism for cooling the plurality of die chips.

7. The system as recited in claim 3 , wherein the gang carrier includes an exhaust shield having an exhaust channel to remove used nitrogen and formic acid vapors from the low oxygen die chip environment.

8. An arrangement for the manufacture of a die chip assembly onto a receiver substrate, comprising:

a donor chuck configured to support on an upper surface thereof a chip carrier with a preassembled die chip arrangement thereon;

a receiver chuck configured to support on an upper surface thereof the receiver substrate;

a guide camera guided die chip gripper for removing a preassembled die chip from the chip carrier and depositing the preassembled die chip onto a guide camera monitored die-chip-heating gang carrier;

a gang carrier and preassembled die chip flipper for inverting the gang carrier and the preassembled die chip from an original orientation as provided on the donor chuck to a second orientation rotated by 180°, wherein the gang carrier and preassembled die chip flipper transports the gang carrier and preassembled die chip in the second orientation to a deposition position over the receiver substrate; and

a compression rod positioned to apply a compressive force to the gang carrier to compress and bond the preassembled die chip onto the receiver substrate.

9. The arrangement as recited in claim 8 , wherein the receiver chuck is displaceable, vertically, rotationally and transversely via servomotors to position the receiver substrate at a predetermined location relative to the deposition position of the gang carrier for deposition of preassembled die chip from the gang carrier to the receiver substrate.