Patent Assignment
Reel/Frame 065880/0386
Assignment of Assignor's Interest
Recorded: 2023-12-15
Pages: 8
Assignors
KOBAYASHI, REO
Executed: 2023-11-28
TABATA, TOSHIHITO
Executed: 2023-11-28
HAMADA, KANYA
Executed: 2023-11-28
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, 3191221, JAPAN
Covered Property
(1)
Plating Defects Estimating Method and Semiconductor Device Manufacturing Method
Application:
18/570,706 →
Publication:
US 2024/0282643
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.