Assignment of Assignor's Interest

Recorded: 2024-01-03 Pages: 8

Assignors

TAKAHASHI, NOBUYUKI

Executed: 2023-08-23

KUROKI, KUNIHIRO

Executed: 2023-08-23

SAITO, HAYATO

Executed: 2023-08-23

Assignee

RESONAC CORPORATION

9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 1057325, JAPAN

Covered Property (1)

Method for Producing Bonded Body

Application: 18/573,782 →

Publication: US 2024/0300213

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.