Patent Assignment
Reel/Frame 066009/0360
Assignment of Assignor's Interest
Recorded: 2024-01-03
Pages: 5
Assignors
JENEI, MÁTÉ
Executed: 2023-12-27
CHAN, KOK WAI
Executed: 2023-12-22
TAN, KUAN YEN
Executed: 2023-12-21
Assignee
IQM FINLAND OY
KEILARANTA 19, ESPOO, 02150, FINLAND
Covered Property
(1)
Chip Fabrication Method and Product Including Raised and Recessed Alignment Structures