Patent Assignment
Reel/Frame 066041/0473
Assignment of Assignor's Interest
Recorded: 2024-01-06
Pages: 3
Assignors
PAN, YI-WEN
Executed: 2021-09-16
LI, YOU-LAN
Executed: 2021-10-03
KO, CHUNG-CHI
Executed: 2021-10-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Semiconductor Device Structures