IP Library › Assignment 066062/0466
Patent Assignment
Reel/Frame 066062/0466

Change of Name

Recorded: 2023-12-18 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Direct-Bonded Optoelectronic Interconnect for High-Density Integrated Photonics
Application: 17/318,344 →
Publication: US 2021/0265331
Direct-Bonded Lamination for Improved Image Clarity in Optical Devices
Application: 17/587,921 →
Publication: US 2022/0155490
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2021
From: WANG, LIANG; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 056216/0302 →
Assignment of Assignor's Interest Jan 28, 2022
From: HABA, BELGACEM; KATKAR, RAJESH; MOHAMMED, ILYAS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 058815/0786 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →