Patent Assignment
Reel/Frame 066180/0864
Assignment of Assignor's Interest
Recorded: 2024-01-19
Pages: 3
Assignors
GAO, GUILIAN
Executed: 2020-06-03
MIRKARIMI, LAURA WILLS
Executed: 2020-06-08
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2020-06-08
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Jan 19, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066356/0024 →