IP Library › Assignment 066356/0024
Patent Assignment
Reel/Frame 066356/0024

Change of Name

Recorded: 2024-01-19 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate
Application: 17/825,240 →
Publication: US 2022/0285236
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Jan 19, 2024
From: GAO, GUILIAN; MIRKARIMI, LAURA WILLS; FOUNTAIN, GAIUS GILLMAN, JR.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066180/0864 →