Patent Assignment
Reel/Frame 066217/0780
Assignment of Assignor's Interest
Recorded: 2024-01-23
Pages: 3
Assignors
WU, TSUNG-CHENG
Executed: 2021-02-01
WU, SHENG-YING
Executed: 2021-02-01
LIN, MING-HSIEN
Executed: 2021-02-22
CHEN, CHUN-FU
Executed: 2021-02-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Apparatus and Method of Manufacturing a Semiconductor Device