Patent Assignment
Reel/Frame 066228/0092
Assignment of Assignor's Interest
Recorded: 2024-01-24
Pages: 3
Assignor
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Executed: 2024-01-23
Assignee
OMNIMEASURE TECHNOLOGY INC.
BLDG.21, NO.195, SEC.4, CHUNG HSING RD., CHUTUNG, HSINCHU, TAIWAN
Covered Properties
(3)
System and Method for via Structure Measurement
System, Method and Computer Readable Medium for Through Silicon via Structure Measurement
Measurement System
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 18, 2010
From: KU, YI SHA; HSU, WEI TE; PANG, HSIU LAN; SHYU, DEH MING
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 024099/0369 →
Assignment of Assignor's Interest
Jun 16, 2011
From: KU, YI SHA; HSU, WEI TE
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 026452/0685 →
Assignment of Assignor's Interest
Jan 13, 2016
From: WEI, HSIANG-CHUN; LO, CHUN-WEI; WU, CHIEH-YU; CHO, CHIA-HUNG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 037512/0767 →