Patent Assignment
Reel/Frame 066244/0722
Assignment of Assignor's Interest
Recorded: 2024-01-25
Pages: 5
Assignors
YOUNG, BO-FENG
Executed: 2021-03-16
LIN, YU-MING
Executed: 2021-03-16
CHIA, HAN-JONG
Executed: 2021-03-16
YEONG, SAI-HOOI
Executed: 2021-03-16
HUANG, CHIA-EN
Executed: 2021-03-16
WANG, YIH
Executed: 2021-03-16
LU, SHIH-LIEN LINUS
Executed: 2021-03-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Device and Methods