Patent Assignment
Reel/Frame 066299/0927
Assignment of Assignor's Interest
Recorded: 2024-01-30
Pages: 9
Assignors
SINGH, GULBAGH
Executed: 2020-04-16
LIU, KUAN-LIANG
Executed: 2020-04-16
PO-JEN, WANG
Executed: 2020-04-16
CHUANG, KUN-TSANG
Executed: 2020-04-16
CHEN, HSIN-CHI
Executed: 2020-04-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Wafer with Devices Having Different Top Layer Thicknesses