Patent Assignment
Reel/Frame 066330/0560
Assignment of Assignor's Interest
Recorded: 2024-02-01
Pages: 2
Assignor
YEOM, HYO SUB
Executed: 2024-02-01
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Chip Including Crack Propagation Guide