Patent Assignment
Reel/Frame 066344/0412
Assignment of Assignor's Interest
Recorded: 2024-01-18
Pages: 6
Assignors
KO, SEUNGTAE
Executed: 2024-01-08
LEE, YOUNGJU
Executed: 2024-01-08
CHOI, JAEHONG
Executed: 2024-01-03
HONG, WONBIN
Executed: 2024-01-03
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
11, CHEONGAM-RO, NAM-GU, GYEONGSANGBUK-DO, POHANG-SI, 37673, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including a Semiconductor Element on a Glass Substrate, Where the Semiconductor Element Is Connected to a Feed Line by a Second Pattern and a via Hole
Application:
18/415,219 →
Publication:
US 2024/0154285