Electronic device including a semiconductor element on a glass substrate, where the semiconductor element is connected to a feed line by a second pattern and a via hole
An electronic device includes: a glass substrate including a first surface and a second surface opposite to the first surface; a semiconductor element provided on the first surface of the glass substrate; a first pattern provided on the first surface of the glass substrate, the first pattern being electrically connected to a first end of the semiconductor element; a second pattern provided on the first surface of the glass substrate, the second pattern being electrically connected to a second end of the semiconductor element; a feeding line provided on the second surface of the glass substrate; and a via hole which passes through the glass substrate in a first direction, the via hole electrically connecting the feeding line to the second pattern.
1 . An electronic device comprising:
a glass substrate comprising a first surface and a second surface opposite to the first surface;
a semiconductor element provided on the first surface of the glass substrate;
a first pattern provided on the first surface of the glass substrate, the first pattern being electrically connected to a first end of the semiconductor element;
a second pattern provided on the first surface of the glass substrate, the second pattern being electrically connected to a second end of the semiconductor element;
a feeding line provided on the second surface of the glass substrate; and
a via hole which passes through the glass substrate in a first direction, the via hole electrically connecting the feeding line to the second pattern.
2 . The electronic device of claim 1 , wherein the first pattern has a T shape.
3 . The electronic device of claim 1 , wherein the first pattern comprises:
a first sub-pattern extending in a second direction; and
a second sub-pattern extending in a third direction.
4 . The electronic device of claim 3 , wherein a first end of the first sub-pattern is electrically connected to the first end of the semiconductor element, and
wherein a second end of the first sub-pattern is connected to a central portion of the second sub-pattern.
5 . The electronic device of claim 4 , further comprising a first port electrically connected to the first pattern.
6 . The electronic device of claim 5 , wherein an end of the first port is electrically connected to an end of the second sub-pattern.
7 . The electronic device of claim 1 , wherein the second pattern has a T shape.
8 . The electronic device of claim 7 , wherein the second pattern comprises:
a first sub-pattern extending in a second direction; and
a second sub-pattern extending in a third direction.
9 . The electronic device of claim 8 , wherein a first end of the first sub-pattern is electrically connected to the second end of the semiconductor element, and
wherein a second end of the first sub-pattern is connected to a central portion of the second sub-pattern.
10 . The electronic device of claim 9 , wherein the central portion of the second sub-pattern is electrically connected to an end of the via hole.
11 . The electronic device of claim 10 , further comprising a second port electrically connected to the second pattern, the via hole, and the feeding line.
12 . The electronic device of claim 11 , wherein an end of the second port is electrically connected to the second sub-pattern.
13 . The electronic device of claim 11 , wherein an end of the second port is electrically connected to the via hole.
14 . The electronic device of claim 11 , wherein an end of the second port is electrically connected to the feeding line.
15 . An electronic device comprising:
a plurality of unit cells, each of the unit cells comprising:
a glass substrate comprising a first surface and a second surface opposite to the first surface,
a semiconductor element provided on the first surface of the glass substrate,
a first pattern provided on the first surface of the glass substrate, the first pattern being electrically connected to a first end of the semiconductor element,
a second pattern provided on the first surface of the glass substrate, the second pattern being electrically connected to a second end of the semiconductor element,
a feeding line provided on the second surface of the glass substrate, and
a via hole which passes through the glass substrate in a first direction, the via hole electrically connecting the feeding line to the second pattern; and
a controller that configured to supplies electric signals for the plurality of unit cells.
16 . The electronic device of claim 15 , wherein the first pattern comprises:
a first sub-pattern extending in a second direction perpendicular to the first direction, and
a second sub-pattern extending in a third direction perpendicular to the first direction and the second direction.
17 . The electronic device of claim 16 ,
wherein a first end of the first sub-pattern is electrically connected to the first end of the semiconductor element, and
wherein a second end of the first sub-pattern is connected to a central portion of the second sub-pattern.
18 . The electronic device of claim 17 , further comprising a first port electrically connected to the first pattern.
19 . The electronic device of claim 18 , wherein an end of the first port is electrically connected to an end of the second sub-pattern.
20 . The electronic device of claim 15 , wherein the second pattern comprises:
a first sub-pattern extending in a second direction perpendicular to the first direction, and
a second sub-pattern extending in a third direction perpendicular to the first direction and the second direction.