IP Library › Assignment 066388/0892
Patent Assignment
Reel/Frame 066388/0892

Assignment of Assignor's Interest

Recorded: 2024-02-06 Pages: 5
Assignors
LEE, JEONGSEOK
Executed: 2024-01-31
PARK, HYEIN
Executed: 2024-01-31
LIM, JAEDEOK
Executed: 2024-01-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Electronic Device Including Shielding Member Including Structure for Reducing Deformation
Application: 18/432,920 →
Publication: US 2024/0224410