Electronic device including shielding member including structure for reducing deformation
An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.
1 . An electronic device comprising:
a printed circuit board (PCB) including a ground pad;
an optical sensor disposed on the PCB; and
a shielding member covering the optical sensor,
wherein the shielding member includes:
a first adhesive layer attached on the optical sensor and the ground pad,
a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and
a first cover layer disposed on the first shielding layer, and including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.
2 . The electronic device of claim 1 ,
wherein the optical sensor includes:
a light emitting unit configured to emit light toward an outside of the electronic device, and
a light receiving unit configured to receive light reflected from an object of the outside of the electronic device,
wherein the plurality of first particles are configured to reflect or scatter light transmitted to the first cover layer by being reflected inside of the electronic device after being emitted from the light emitting unit, and
wherein the plurality of second particles are configured to absorb light transmitted to the first cover layer by being reflected inside of the electronic device after being emitted from the light emitting unit.
3 . The electronic device of claim 2 , further comprising:
a housing accommodating the PCB and the optical sensor, and including at least one opening region disposed on the optical sensor,
wherein the plurality of first particles are configured to reflect or scatter light that causes noise of the optical sensor by being reflected inside of the housing after being emitted from the light emitting unit, and
wherein the plurality of second particles are configured to absorb light that causes noise of the optical sensor by being reflected inside of the housing after being emitted from the light emitting unit.
4 . The electronic device of claim 2 , wherein the shielding member further includes:
a first opening penetrating the shielding member and disposed on the light emitting unit; and
a second opening penetrating the shielding member and disposed on the light receiving unit.
5 . The electronic device of claim 1 , wherein a size of each of the plurality of second particles is smaller than a size of each of the plurality of first particles.
6 . The electronic device of claim 1 , wherein the plurality of first particles include metal particles configured to reflect or scatter the light.
7 . The electronic device of claim 1 , wherein the plurality of second particles includes carbon black.
8 . The electronic device of claim 1 , wherein the binder includes polyurethane (PU) defining one layer together with the plurality of first particles and the plurality of second particles.
9 . The electronic device of claim 1 , wherein the binder has a light transmittance higher than a light transmittance of each of the plurality of first particles and the plurality of second particles.
10 . The electronic device of claim 1 , wherein the first shielding layer includes at least one of nanofiber and metal, electrically connected to the ground pad.
11 . The electronic device of claim 1 , wherein the first adhesive layer includes a conductive material electrically connecting the ground pad and the first shielding layer.
12 . The electronic device of claim 1 , wherein the first shielding layer includes a plurality of irregularities disposed on an outer surface of the first cover layer and defined by the plurality of first particles.
13 . The electronic device of claim 1 ,
wherein a weight ratio of the binder to a total weight of the first cover layer is 10% to 40%,
wherein a weight ratio of the plurality of first particles to the total weight of the first cover layer is 12% to 45%, and
wherein a weight ratio of the plurality of second particles to the total weight of the first cover layer is 30% to 72%.
14 . The electronic device of claim 1 ,
wherein the shielding member further includes:
a second adhesive layer distinct from the first adhesive layer and disposed on the first shielding layer, and
a second shielding layer distinct from the first shielding layer and disposed on the second adhesive layer, and
wherein the first cover layer is disposed on the second shielding layer.
15 . The electronic device of claim 1 ,
wherein the first cover layer is spaced apart from the first shielding layer, and
wherein the shielding member further includes:
a second cover layer distinct from the first cover layer and disposed on the first shielding layer,
a second adhesive layer distinct from the first adhesive layer and disposed on the second cover layer, and
a second shielding layer distinct from the first shielding layer and interposed between the second adhesive layer and the first cover layer.
16 . An electronic device comprising:
a housing including one surface supporting a display and another surface opposite to the one surface;
a printed circuit board (PCB) including a ground pad and disposed in the housing;
an optical sensor disposed on the PCB, and including:
a light emitting unit configured to emit light toward the another surface of the housing, and
a light receiving unit configured to receive light emitted from the light emitting unit and reflected from an object of an outside of the electronic device; and
a shielding member covering the optical sensor and at least a portion of the PCB,
wherein the shielding member includes:
a first adhesive layer attached on the optical sensor and the ground pad,
a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and
a first cover layer disposed on the first shielding layer, and including a plurality of first particles configured to reflect or scatter light reflected inside of the housing after being emitted from the light emitting unit, a plurality of second particles configured to absorb the light reflected inside of the housing after being emitted from the light emitting unit, and a binder defining a mixture together with the plurality of first particles and the plurality of second particles by covering the plurality of first particles and the plurality of second particles.
17 . The electronic device of claim 16 , wherein the housing further includes at least one opening region penetrating the housing and corresponding to the optical sensor.
18 . The electronic device of claim 16 , wherein the shielding member further includes:
a first opening penetrating the shielding member and disposed on the light emitting unit; and
a second opening penetrating the shielding member and disposed on the light receiving unit.
19 . The electronic device of claim 16 , wherein a size of each of the plurality of second particles is smaller than a size of each of the plurality of first particles.
20 . The electronic device of claim 16 , wherein the binder has a light transmittance higher than a light transmittance of each of the plurality of first particles and the plurality of second particles.