Patent Assignment
Reel/Frame 066439/0886
Assignment of Assignor's Interest
Recorded: 2024-02-12
Pages: 2
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Bonding Composition, Conductor Bonding Structure, and Method for Producing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.