Bonding composition, conductor bonding structure, and method for producing same
A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydrox ymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s−1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.
1 . A method for producing a conductor bonding structure, the method comprising:
applying onto a surface of a first conductor a bonding composition comprising copper powder, a liquid medium and a reducing agent to form a coating film;
drying the coating film to obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
sintering, under pressure, the copper powder contained in the dried coating film to bond the first conductor and the second conductor,
wherein the reducing agent has a boiling point that is higher than the boiling point of the liquid medium,
the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder,
the liquid medium comprises an alcohol having a boiling point of 188° C. or higher and lower than 300° C.,
a proportion of the liquid medium is from 10 parts to 40 parts by mass with respect to 100 parts by mass of the copper powder, and
the reducing agent contains at least one amino group and a plurality of hydroxyl groups.
2 . The method according to claim 1 , wherein the coating film is dried in such a manner that the content of the liquid medium is reduced to 9 mass % or less with respect to the total mass of the coating film.
3 . The method according to claim 1 , wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s −1 at 25° C.
4 . The method according to claim 1 , wherein the bonding composition contains the reducing agent at an amount of from 0.1 parts to 10 parts by mass with respect to 100 parts by mass of the copper powder.
5 . A method for bonding conductors, the method comprising:
applying onto a surface of a first conductor a bonding composition comprising copper powder, a liquid medium and a reducing agent to form a coating film;
drying the coating film to obtain a dried coating film;
applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and
sintering, under pressure, the copper powder contained in the dried coating film to bond the first conductor and the second conductor,
wherein the reducing agent has a boiling point that is higher than the boiling point of the liquid medium,
the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder,
the liquid medium comprises an alcohol having a boiling point of 188° C. or higher and lower than 300° C.,
a proportion of the liquid medium is from 10 parts to 40 parts by mass with respect to 100 parts by mass of the copper powder, and
the reducing agent contains at least one amino group and a plurality of hydroxyl groups.
6 . The method according to claim 5 , wherein the coating film is dried in such a manner that the content of the liquid medium is reduced to 9 mass % or less with respect to the total mass of the coating film.
7 . The method according to claim 5 , wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pas at a shear rate of 10 s −1 at 25° C.
8 . The method according to claim 5 , wherein the bonding composition contains the reducing agent at an amount of from 0.1 parts to 10 parts by mass with respect to 100 parts by mass of the copper powder.
9 . A bonding composition used for bonding a first conductor and a second conductor under pressure, wherein:
the bonding composition comprises copper powder, a liquid medium and a reducing agent,
the reducing agent has a boiling point that is higher than the boiling point of the liquid medium,
the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder,
the liquid medium comprises an alcohol having a boiling point of 188° C. or higher and lower than 300° C.,
a proportion of the liquid medium is from 10 parts to 40 parts by mass with respect to 100 parts by mass of the copper powder, and
the reducing agent contains at least one amino group and a plurality of hydroxyl groups.
10 . The bonding composition according to claim 9 , wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s −1 at 25° C.
11 . The bonding composition according to claim 9 , wherein the bonding composition contains the reducing agent at an amount of from 0.1 parts to 10 parts by mass with respect to 100 parts by mass of the copper powder.
12 . A conductor bonding structure, in which two conductors are electrically connected by a joint portion, wherein:
the joint portion comprises a sintered structure of copper materials; and
a moiety shown below is formed in the joint portion:
wherein:
* represents a bonding hand with copper.
13 . The bonding composition according to claim 9 , wherein the alcohol comprises a polyol.