IP Library › Assignment 066495/0526
Patent Assignment
Reel/Frame 066495/0526

Change of Name

Recorded: 2024-02-06 Pages: 7
Assignor
Assignee
ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO., LTD.
DONGJIU AVENUE, YIXING ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, WUXI, JIANGSU, 214203, CHINA
Covered Properties (2)
Control Method of Grinding Water Flow Rate During Double Side Grinding Process
Application: 17/192,918 →
Publication: US 2021/0276150
Method and Apparatus for Final Polishing of Silicon Wafer
Application: 17/264,514 →
Publication: US 2021/0296133
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 1, 2021
From: ZHENG, JIAZHEN
To: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 055090/0460 →
Change of Name Jun 8, 2023
From: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD.
To: ZHONGHUAN ADVANCED (XUZHOU) SEMICONDUCTOR MATERIALS CO., LTD.
Reel/Frame 063889/0983 →
Assignment of Assignor's Interest Jun 11, 2023
From: ZHONGHUAN ADVANCED (XUZHOU) SEMICONDUCTOR MATERIALS CO., LTD.
To: ZHONGHUAN ADVANCED SEMICONDUCTOR MATERIALS CO., LTD.
Reel/Frame 063916/0190 →
Change of Name Feb 4, 2024
From: ZHONGHUAN ADVANCED SEMICONDUCTOR MATERIALS CO., LTD
To: ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 066489/0307 →