Patent Assignment
Reel/Frame 066520/0919
Assignment of Assignor's Interest
Recorded: 2024-02-21
Pages: 5
Assignors
CHANG, KAI-FUNG
Executed: 2024-02-14
LIANG, CHIN-WEI
Executed: 2023-11-20
WENG, SHENG-FENG
Executed: 2023-11-23
YEN, MING-YU
Executed: 2023-11-20
LIU, CHEYU
Executed: 2023-12-14
CHEN, HUNG-CHIH
Executed: 2023-11-23
LEI, YI-YANG
Executed: 2023-11-20
HSIEH, CHING-HUA
Executed: 2023-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packaged Interconnect Structures
Application:
18/306,702 →
Publication:
US 2024/0113032