Patent Assignment
Reel/Frame 066529/0651
Assignment of Assignor's Interest
Recorded: 2024-02-22
Pages: 5
Assignors
KOMATIREDDI, RAHUL REDDY
Executed: 2023-04-03
CHERIKKALLIL, ROHITH
Executed: 2023-04-02
KONGARA, SNEHA RUBA
Executed: 2024-01-24
DANGAYACH, SACHIN
Executed: 2023-04-10
MALLAVARAM, KRISHNAPRASAD REDDY
Executed: 2024-02-05
MISHRA, SATWIK SWARUP
Executed: 2023-09-18
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Automation Method for Defect Characterization for Hybrid Bonding Application
Application:
18/128,496 →
Publication:
US 2024/0330671
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2024
From: LIANTO, PRAYUDI; SUO, PENG; CHAN, SI EN; KOH, REMUS ZHEN HUI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 066530/0137 →
Assignment of Assignor's Interest
Apr 8, 2024
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 067032/0689 →