Patent Assignment
Reel/Frame 066530/0137
Assignment of Assignor's Interest
Recorded: 2024-02-22
Pages: 5
Assignors
LIANTO, PRAYUDI
Executed: 2023-03-31
SUO, PENG
Executed: 2023-03-31
CHAN, SI EN
Executed: 2023-04-04
KOH, REMUS ZHEN HUI
Executed: 2023-04-12
CHENG, KHOR WUI
Executed: 2023-03-31
LIM, YIN WEI
Executed: 2023-04-10
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Automation Method for Defect Characterization for Hybrid Bonding Application
Application:
18/128,496 →
Publication:
US 2024/0330671
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2024
From: KOMATIREDDI, RAHUL REDDY; CHERIKKALLIL, ROHITH; KONGARA, SNEHA RUBA; DANGAYACH, SACHIN
To: APPLIED MATERIALS, INC.
Reel/Frame 066529/0651 →
Assignment of Assignor's Interest
Apr 8, 2024
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 067032/0689 →