IP Library › Assignment 066530/0312
Patent Assignment
Reel/Frame 066530/0312

Assignment of Assignor's Interest

Recorded: 2024-02-22 Pages: 8
Assignors
GLASS, PAUL SAMUEL
Executed: 2024-02-05
DESHPANDE, SHREE
Executed: 2024-02-08
BOHN, JUSTIN
Executed: 2024-02-09
GEIKOWSKY, ELLIOT
Executed: 2024-02-05
Assignee
SETEX TECHNOLOGIES, INC.
91 43RD STREET, SUITE 130, PITTSBURGH, PENNSYLVANIA, 15201
Covered Properties (2)
Dry Adhesive for Temporary Bonding of Semiconductor Devices
Application: 18/015,275 →
Publication: US 2023/0260818
Dry Adhesive for Temporary Bonding of Semiconductor Devices
Application: 63/049,314 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 23, 2021
From: NANOGRIPTECH, INC.
To: SETEX TECHNOLOGIES, INC.
Reel/Frame 058468/0740 →
Assignment of Assignor's Interest Jun 14, 2024
From: SETEX TECHNOLOGIES, INC.
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 067727/0865 →