Patent Assignment
Reel/Frame 067727/0865
Assignment of Assignor's Interest
Recorded: 2024-06-14
Pages: 7
Assignor
SETEX TECHNOLOGIES, INC.
Executed: 2024-04-10
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
MARUNOUCHI EIRAKU BLDG., 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, 100-0005, JAPAN
Covered Properties
(7)
Dry Adhesive for Temporary Bonding of Semiconductor Devices
PCT:
PCT/US2021/040966 ↗
An Adhesive Material Having Microstructures and Permeation-Resistent Properties
PCT:
PCT/US2022/018194 ↗
Adhesive Material Having Microstructures and Permeation-Resistant Properties
Dry Adhesive for Temporary Bonding of Semiconductor Devices
Dry Adhesive for Temporary Bonding of Semiconductor Devices
Application:
63/049,314 →
Adhesive Material Having Microstructures and Permeation-Resistent Properties
Application:
63/154,339 →
Low-Residue High Temperature-Resistant Dry Adhesive and Methods of Use
Application:
63/434,377 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2021
From: GLASS, PAUL; DELUCA, AIMEE; AKSAK, BURAK
To: NANOGRIPTECH, INC.
Reel/Frame 056451/0762 →
Assignment of Assignor's Interest
Dec 23, 2021
From: NANOGRIPTECH, INC.
To: SETEX TECHNOLOGIES, INC.
Reel/Frame 058468/0740 →
Assignment of Assignor's Interest
Apr 14, 2023
From: GLASS, PAUL SAMUEL; DELUCA, AIMEE; AKSAK, BURAK
To: SETEX TECHNOLOGIES, INC.
Reel/Frame 063329/0919 →
Assignment of Assignor's Interest
Feb 22, 2024
From: GLASS, PAUL SAMUEL; DESHPANDE, SHREE; BOHN, JUSTIN; GEIKOWSKY, ELLIOT
To: SETEX TECHNOLOGIES, INC.
Reel/Frame 066530/0312 →
Assignment of Assignor's Interest
Feb 26, 2024
From: AKSAK, BURAK; GEIKOWSKY, ELLIOT
To: SETEX TECHNOLOGIES, INC.
Reel/Frame 066563/0076 →