Dry adhesive for temporary bonding of semiconductor devices
A dry adhesive microfiber array comprising a plurality of fibers with enlarged tips, where the dry adhesive is capable of adhering to a surface of a silicon wafer and/or carrier. The dry adhesive can be debonded without the use of chemicals or heat and does not leave a residue on the surface of the wafer. In addition, a liquid can be introduced to the interface between the dry adhesive and semiconductor device to adjust the force of adhesion.
1 . An apparatus for processing a semiconductor device comprising:
a carrier;
a microfiber array having a plurality of fibers terminating in enlarged tips, wherein the microfiber array is affixed to the carrier, wherein the enlarged tips are adapted to contact a surface of the semiconductor device, wherein the enlarged tips are adapted to release from the semiconductor device through a mechanical movement;
a liquid disposed at an interface between the enlarged tips and the surface of the semiconductor device, wherein the liquid is adapted to increase a force of adhesion of the interface between the enlarged tips and the surface of the semiconductor device.
2 . The apparatus of claim 1 , wherein the liquid is dryable.
3 . The apparatus of claim 2 , wherein the liquid comprises water or alcohol.
4 . The apparatus of claim 3 , wherein the liquid comprises isopropyl alcohol.
5 . The apparatus of claim 1 , wherein the liquid does not provide direct adhesion.
6 . The apparatus of claim 1 , wherein the liquid is not an adhesive.
7 . A method comprising:
providing a microfiber array having a plurality of fibers, the plurality of fibers terminating in enlarged tips, the microfiber array being affixed to a carrier;
wetting an interface between the enlarged tips and the surface of a semiconductor device the microfiber array to increase a force of adhesion of the interface between the enlarged tips and the surface of the semiconductor device;
adhering a surface of the semiconductor device to the microfiber array after wetting the enlarged tips; and
manipulating a position of the carrier while the surface of the semiconductor device is adhered to the microfiber array.
8 . The method of claim 7 , further comprising:
adjusting a bond strength of the microfiber array by varying the density of the plurality of fibers.
9 . The method of claim 7 , further comprising:
drying the microfiber array prior to removing the semiconductor device from the carrier.
10 . The method of claim 7 , wherein the liquid comprises water or alcohol.
11 . The method of claim 10 , wherein the liquid comprises isopropyl alcohol.
12 . The method of claim 7 , wherein the semiconductor device comprises a silicon wafer.
13 . The method of claim 12 , further comprising:
debonding the microfiber array from the silicon wafer through a mechanical movement.
14 . The method of claim 13 , wherein the mechanical movement comprises peeling the microfiber array from the silicon wafer.
15 . The method of claim 13 , wherein the mechanical movement comprises a movement of the silicon wafer in a direction parallel to a surface of the carrier.
16 . The method of claim 7 , wherein the liquid does not provide direct adhesion.
17 . The method of claim 7 , wherein the liquid is not an adhesive.