Patent Assignment
Reel/Frame 066577/0653
Assignment of Assignor's Interest
Recorded: 2024-02-27
Pages: 5
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2023-11-21
ZHAO, OLIVER
Executed: 2023-11-21
LEE, BONGSUB
Executed: 2023-11-20
MIRKARIMI, LAURA WILLS
Executed: 2024-02-26
SUWITO, DOMINIK
Executed: 2023-11-20
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Expansion Controlled Structure for Direct Bonding and Method of Forming Same