Patent Assignment
Reel/Frame 066589/0055
Assignment of Assignor's Interest
Recorded: 2024-02-28
Pages: 3
Assignors
LIN, CHIH-MIN
Executed: 2021-07-19
HSU, HUNG-JEN
Executed: 2021-07-22
YAUNG, DUN-NIAN
Executed: 2021-07-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Wafer Integration