Multi-wafer integration
View Patent ↗Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.
1 . A semiconductor device, comprising:
a printed circuit board;
a first substrate comprising one high-performance computing integrated circuit (HPC IC) and bonded to the printed circuit board;
a second substrate comprising a plurality of electronic ICs (EICs) and bonded directly to the first substrate such that the first substrate is disposed between the printed circuit board and the second substrate; and
a third substrate comprising a plurality of photonic integrated circuits (PICs) and bonded directly to the second substrate,
wherein no underfill material is present between the first substrate and the second substrate and between the second substrate and the third substrate.
2 . The semiconductor device of claim 1 , wherein spaces among the plurality of EICs are not filled with a molding material.
3 . The semiconductor device of claim 1 , wherein spaces among the plurality of PICs are not filled with a molding material.
4 . The semiconductor device of claim 1 ,
wherein the second substrate comprises first contact features embedded in a first dielectric layer,
wherein the third substrate comprises second contact features embedded in a second dielectric layer,
wherein surfaces of the first contact features are aligned and in contact with surfaces of the second contact features respectively,
wherein surfaces of the first dielectric layer are in contact with surfaces of the second dielectric layer.
5 . The semiconductor device of claim 1 , wherein each of the plurality of PICs comprises photodiodes, waveguides, and modulators.
6 . The semiconductor device of claim 1 , wherein the plurality of EICs are free of photodiodes, waveguides, and modulators.
7 . The semiconductor device of claim 1 ,
wherein the plurality of EICs comprise between about 10 and about 100 EICs,
wherein the plurality of PICs comprise between about 10 and about 100 PICs.
8 . The semiconductor device of claim 1 , wherein each of the plurality of PICs comprises an optical signal opening that extends partially into each of the plurality of PICs.
9 . A semiconductor device, comprising:
a base substrate;
a first substrate comprising a plurality of photonic integrated circuits (PICs) and bonded directly to the base substrate;
a second substrate comprising a plurality of electronic ICs (EICs) and bonded directly to the first substrate;
a third substrate comprising one high-performance computing integrated circuit (HPC IC) and bonded directly to the second substrate; and
an optical signal opening extending through the third substrate, the second substrate, and partially into the first substrate.
10 . The semiconductor device of claim 9 , wherein no underfill material is present between the first substrate and the second substrate and between the second substrate and the third substrate.
11 . The semiconductor device of claim 9 ,
wherein the second substrate comprises first contact features embedded in a first dielectric layer,
wherein the third substrate comprises second contact features embedded in a second dielectric layer,
wherein surfaces of the first contact features are aligned and in contact with surfaces of the second contact features respectively,
wherein surfaces of the first dielectric layer are in contact with surfaces of the second dielectric layer.
12 . The semiconductor device of claim 11 ,
wherein the surfaces of the first contact features and the surfaces of the first dielectric layer are coplanar,
wherein the surfaces of the second contact features and the surfaces of the second dielectric layer are coplanar.
13 . The semiconductor device of claim 9 , wherein each of the plurality of PICs comprises photodiodes, waveguides, and modulators.
14 . The semiconductor device of claim 9 , wherein spaces among the plurality of EICs are not filled with a molding material.
15 . The semiconductor device of claim 9 , wherein spaces among the plurality of PICs are not filled with a molding material.
16 . A device structure, comprising:
a first substrate comprising one high-performance computing integrated circuit (HPC IC);
a second substrate comprising a plurality of electronic ICs (EICs) and bonded directly to the first substrate; and
a third substrate comprising a plurality of photonic integrated circuits (PICs) and bonded directly to the second substrate,
wherein each of the plurality of PICs comprises an optical signal opening that extends partially into each of the plurality of PICs.
17 . The device structure of claim 16 ,
wherein the first substrate comprises first contact features embedded in a first dielectric layer,
wherein the second substrate comprises second contact features embedded in a second dielectric layer,
wherein surfaces of the first contact features are aligned and in contact with surfaces of the second contact features respectively,
wherein surfaces of the first dielectric layer are in contact with surfaces of the second dielectric layer.
18 . The device structure of claim 17 ,
wherein the surfaces of the first contact features and the surfaces of the first dielectric layer are coplanar,
wherein the surfaces of the second contact features and the surfaces of the second dielectric layer are coplanar.
19 . The device structure of claim 16 ,
wherein the plurality of EICs comprise between about 10 and about 100 EICs,
wherein the plurality of PICs comprise between about 10 and about 100 PICs.
20 . The device structure of claim 16 , wherein spaces among the plurality of EICs are not filled with a molding material.