Assignment of Assignor's Interest

Recorded: 2024-02-29 Pages: 6

Assignors

IM, CHANG GYU

Executed: 2024-02-22

SEO, JANG WON

Executed: 2024-02-22

YUN, JONG WOOK

Executed: 2024-02-22

AN, JOON HO

Executed: 2024-02-22

Assignee

SK ENPULSE CO., LTD.

1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF

Covered Property (1)

Polishing Pad and Preparing Method of Semiconductor Device

Application: 18/590,378 →

Publication: US 2024/0300066

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.