Patent Assignment
Reel/Frame 071277/0667
Assignment of Assignor's Interest
Recorded: 2025-06-02
Pages: 6
Assignor
SK ENPULSE CO., LTD.
Executed: 2025-04-25
Assignee
ENPULSE CO., LTD.
3RD FLOOR, 3-DONG, 112, SEONGGEO-GIL, SEONGGEO-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, 31044, KOREA, REPUBLIC OF
Covered Properties
(44)
Polishing Pad with Adjusted Crosslinking Degree and Process for Preparing the Same
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/104,829 →
Publication:
US 2021/0162560
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/101,363 →
Publication:
US 2021/0154797
Polishing Pad, Preparation Method Thereof and Method for Preparing Semiconductor Device Using Same
Application:
18/783,438 →
Publication:
US 2025/0018526
Polishing Pad and Method for Preparing Semiconductor Device Using the Same
Polishing Pad and Method for Preparing a Semiconductor Device Using the Same
Polishing Pad with Improved Wettability and Method for Preparing Same
Application:
18/298,378 →
Publication:
US 2023/0330806
Method for Manufacturing a Polishing Sheet and a Polishing Pad
Application:
18/361,910 →
Publication:
US 2024/0066661
Polishing Pad and Preparation Method Thereof
Application:
18/581,387 →
Publication:
US 2024/0308022
Polishing Pad and Method of Monitoring a Polishing Process Using the Same
Application:
18/538,695 →
Publication:
US 2024/0227113
Polishing Pad, Pyrolysis Oil Obtained Therefrom, and Process for Preparing the Same
Application:
18/413,034 →
Publication:
US 2024/0263080
Polishing Pad with Adjusted Content of Chlorine and Process for Preparing Semiconductor Device Using the Same
Application:
18/609,288 →
Publication:
US 2024/0342857
Polishing Pad with Improved Slurry Flowability and Process for Preparing a Semiconductor Device Using the Same
Application:
18/817,224 →
Publication:
US 2025/0144764
Polishing Pad and Process for Preparing the Same
Application:
18/814,597 →
Publication:
US 2025/0144763
Eco-Friendly Polishing Pad and Manufacturing Method Thereof
Application:
18/741,785 →
Publication:
US 2025/0065467
Polishing Pad with Reduced Defect and Method of Preparing a Semiconductor Device Using the Same
Application:
18/747,451 →
Publication:
US 2025/0033160
Polishing Pad and Method of Manufacturing a Semiconductor Device Using the Same
Application:
18/882,756 →
Publication:
US 2025/0144766
Polishing Pad with Excellent Recyclability and Pyrolysis Oil Obtained Therefrom
Application:
18/884,117 →
Publication:
US 2025/0144767
Conditioning Device and Method for Controlling the Conditioning Device
Application:
18/302,786 →
Publication:
US 2023/0339072
Polishing Pad and Preparing Method of Semiconductor Device
Application:
18/590,378 →
Publication:
US 2024/0300066
Porous Polyurethane Polishing Pad and Method for Manufacturing Same
Polishing Pad and Method for Producing Same
Polishing Pad Comprising Window Similar in Hardness to Polishing Layer
Polishing Pad Having Excellent Airtightness
Porous Polyurethane Polishing Pad and Preparation Method Thereof
Porous Polyurethane Polishing Pad and Process for Preparing the Same
Leakage-Proof Polishing Pad and Process for Preparing the Same
Polishing Pad with Improved Fluidity of Slurry and Process for Preparing Same
Porous Polishing Pad and Process for Producing the Same
Porous Polyurethane Polishing Pad and Process for Producing the Same
Composition for a Polishing Pad, Polishing Pad, and Process for Preparing the Same
Polishing Pad That Minimizes Occurrence of Defects and Process for Preparing the Same
Polishing Pad with Improved Crosslinking Density and Process for Preparing the Same
Composition for Polishing Pad, Polishing Pad and Preparation Method Thereof
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Composition for Polishing Pad, Polishing Pad and Preparation Method of Semiconductor Device
Composition for Polishing Pad and Polishing Pad
Polishing Pad, Preparation Method Thereof and Method for Preparing Semiconductor Device Using Same
Polishing Pad, Preparation Method Thereof and Method for Preparing Semiconductor Device Using Same
Porous Polyurethane Polishing Pad and Process for Preparing a Semiconductor Device by Using the Same
Porous Polyurethane Polishing Pad and Process for Preparing a Semiconductor Device by Using the Same
Polishing Pad and Method for Preparing Semiconductor Device Using Same
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 17, 2019
From: HEO, HYE YOUNG; SEO, JANG WON; HAN, HYUK HEE
To: SKC CO., LTD.
Reel/Frame 049216/0015 →
Assignment of Assignor's Interest
Jul 22, 2019
From: RYOU, JOONSUNG; KWON, TAE KYOUNG; SEO, JANG WON; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 049822/0259 →
Assignment of Assignor's Interest
Dec 4, 2019
From: YUN, SUNGHOON; RYOU, JOONSUNG; SEO, JANG WON; AHN, JAEIN
To: SKC CO., LTD.
Reel/Frame 051179/0338 →
Assignment of Assignor's Interest
Aug 25, 2020
From: YUN, JONG WOOK; JOENG, EUN SUN; SEO, JANG WON
To: SKC CO., LTD.
Reel/Frame 053592/0985 →
Assignment of Assignor's Interest
Nov 23, 2020
From: HEO, HYEYOUNG; YUN, SUNGHOON; SEO, JANG WON; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 054444/0461 →
Assignment of Assignor's Interest
Nov 25, 2020
From: AHN, JAEIN; KIM, KYUNG HWAN; YUN, SUNGHOON; HEO, HYEYOUNG
To: SKC CO., LTD.
Reel/Frame 054470/0970 →
Assignment of Assignor's Interest
Mar 23, 2021
From: SKC CO., LTD.
To: SKC SOLMICS CO., LTD.
Reel/Frame 055685/0677 →
Assignment of Assignor's Interest
Aug 11, 2021
From: YUN, JONG WOOK; HEO, HYEYOUNG; AHN, JAEIN; KIM, KYUNG HWAN
To: SKC SOLMICS CO., LTD.
Reel/Frame 057151/0813 →
Assignment of Assignor's Interest
Apr 28, 2022
From: YUN, JONG WOOK; JOENG, EUN SUN; SEO, JANGWON; HEO, HYEYOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059767/0418 →
Change of Name
Feb 13, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 062717/0084 →
Assignment of Assignor's Interest
Apr 11, 2023
From: IM, CHANG GYU; SEO, JANGWON; YUN, JONG WOOK; YUN, SUNGHOON
To: SK ENPULSE CO., LTD.
Reel/Frame 063293/0345 →
Assignment of Assignor's Interest
Apr 19, 2023
From: YUN, JONG WOOK; SEO, JANG WON; MOON, SU YOUNG; KIM, KYUNG HWAN
To: SK ENPULSE CO., LTD.
Reel/Frame 063368/0185 →
Assignment of Assignor's Interest
Jul 31, 2023
From: AN, JOONHO; SEO, JANGWON; IM, CHANG GYU; YUN, JONG WOOK
To: SK ENPULSE CO., LTD.
Reel/Frame 064429/0605 →
Assignment of Assignor's Interest
Dec 13, 2023
From: AN, JOONHO; SEO, JANGWON; IM, CHANG GYU; KIM, KYUNG HWAN
To: SK ENPULSE CO., LTD.
Reel/Frame 065861/0267 →
Assignment of Assignor's Interest
Jan 16, 2024
From: IM, CHANG GYU; SEO, JANGWON
To: SK ENPULSE CO., LTD.
Reel/Frame 066125/0873 →
Assignment of Assignor's Interest
Feb 20, 2024
From: JI, MIN GYEONG; YUN, JONG WOOK; SEO, JANGWON
To: SK ENPULSE CO., LTD.
Reel/Frame 066492/0626 →
Assignment of Assignor's Interest
Feb 29, 2024
From: IM, CHANG GYU; SEO, JANG WON; YUN, JONG WOOK; AN, JOON HO
To: SK ENPULSE CO., LTD.
Reel/Frame 066597/0286 →
Assignment of Assignor's Interest
Mar 19, 2024
From: YUN, JONG WOOK; SHIN, YUJIN; MOON, SUYOUNG; MIN, EUN GI
To: SK ENPULSE CO., LTD.
Reel/Frame 066823/0811 →
Assignment of Assignor's Interest
Jun 13, 2024
From: JI, MINGYEONG; YOON, JONGWOOK; SEO, JANGWON; MOON, SUYOUNG
To: SK ENPULSE CO., LTD.
Reel/Frame 067711/0203 →
Assignment of Assignor's Interest
Jun 19, 2024
From: SHIN, YUJIN; YOON, JONGWOOK; SEO, JANGWON; KIM, KYUNGHWAN
To: SK ENPULSE CO., LTD.
Reel/Frame 067765/0495 →
Assignment of Assignor's Interest
Aug 26, 2024
From: KIM, YOUNGHWAN; SEO, JANGWON; YOON, JONGWOOK; MIN, EUNGI
To: SK ENPULSE CO., LTD.
Reel/Frame 068392/0541 →
Assignment of Assignor's Interest
Aug 28, 2024
From: SHIN, YUJIN; YOON, JONGWOOK; AN, JOONHO; KIM, KYUNGHWAN
To: SK ENPULSE CO., LTD.
Reel/Frame 068419/0247 →
Assignment of Assignor's Interest
Sep 12, 2024
From: SHIN, YUJIN; AN, JOONHO; KIM, KYUNGHWAN; SEO, JANGWON
To: SK ENPULSE CO., LTD.
Reel/Frame 068562/0568 →
Assignment of Assignor's Interest
Sep 13, 2024
From: KIM, YOUNGHWAN; YOON, JONGWOOK; SEO, JANGWON
To: SK ENPULSE CO., LTD.
Reel/Frame 068575/0966 →