IP Library › Assignment 059767/0418
Patent Assignment
Reel/Frame 059767/0418

Assignment of Assignor's Interest

Recorded: 2022-04-28 Pages: 6
Assignors
YUN, JONG WOOK
Executed: 2022-03-03
JOENG, EUN SUN
Executed: 2022-03-03
SEO, JANGWON
Executed: 2022-03-03
HEO, HYEYOUNG
Executed: 2022-03-03
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad and Method for Preparing a Semiconductor Device Using the Same
Application: 17/731,410 →
Publication: US 2022/0410337
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 13, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 062717/0084 →
Assignment of Assignor's Interest Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →