Patent Assignment
Reel/Frame 062717/0084
Change of Name
Recorded: 2023-02-13
Pages: 5
Assignor
SKC SOLMICS CO., LTD.
Executed: 2023-01-01
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(31)
Porous Polyurethane Polishing Pad and Preparation Method Thereof
Porous Polyurethane Polishing Pad and Process for Preparing the Same
Porous Polishing Pad and Process for Producing the Same
Porous Polyurethane Polishing Pad and Process for Producing the Same
Polishing Pad and Method for Producing Same
Polishing Pad Having Excellent Airtightness
Polishing Pad Comprising Window Similar in Hardness to Polishing Layer
Polishing Pad with Improved Crosslinking Density and Process for Preparing the Same
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Polishing Pad with Adjusted Crosslinking Degree and Process for Preparing the Same
Composition for Polishing Pad and Polishing Pad
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/104,829 →
Publication:
US 2021/0162560
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/077,216 →
Publication:
US 2021/0138605
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/101,363 →
Publication:
US 2021/0154797
Polishing Pad, Preparation Method Thereof and Method for Preparing Semiconductor Device Using Same
Polishing Pad, Preparation Method Thereof and Method for Preparing Semiconductor Device Using Same
Polishing Pad and Method for Preparing Semiconductor Device Using the Same
Polishing Pad and Method for Preparing a Semiconductor Device Using the Same
Porous Polyurethane Polishing Pad and Process for Preparing a Semiconductor Device by Using the Same
Porous Polyurethane Polishing Pad and Process for Preparing a Semiconductor Device by Using the Same
Polishing Pad and Method for Preparing Semiconductor Device Using Same
Leakage-Proof Polishing Pad and Process for Preparing the Same
Polishing Pad with Improved Fluidity of Slurry and Process for Preparing Same
Porous Polyurethane Polishing Pad and Method for Manufacturing Same
Composition for Semiconductor Process and Semiconductor Process
Composition for a Polishing Pad, Polishing Pad, and Process for Preparing the Same
Polishing Pad That Minimizes Occurrence of Defects and Process for Preparing the Same
Composition for Polishing Pad, Polishing Pad and Preparation Method Thereof
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Composition for Polishing Pad, Polishing Pad and Preparation Method of Semiconductor Device
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 26, 2018
From: SEO, JANG WON; HAN, HYUK HEE; HEO, HYE YOUNG; RYOU, JOONSUNG
To: SKC CO., LTD.
Reel/Frame 047329/0755 →
Assignment of Assignor's Interest
Dec 28, 2018
From: SEO, JANG WON; HAN, HYUK HEE; HEO, HYE YOUNG; RYOU, JOONSUNG
To: SKC CO., LTD.
Reel/Frame 047869/0491 →
Assignment of Assignor's Interest
Apr 16, 2019
From: HEO, HYE YOUNG; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 048897/0822 →
Assignment of Assignor's Interest
Apr 19, 2019
From: HEO, HYE YOUNG; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 048942/0303 →
Assignment of Assignor's Interest
Jul 22, 2019
From: RYOU, JOONSUNG; KWON, TAE KYOUNG; SEO, JANG WON; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 049822/0259 →
Assignment of Assignor's Interest
Oct 15, 2019
From: YUN, SUNGHOON; SEO, JANG WON; AHN, JAEIN; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 050722/0769 →
Assignment of Assignor's Interest
Dec 4, 2019
From: YUN, SUNGHOON; RYOU, JOONSUNG; SEO, JANG WON; AHN, JAEIN
To: SKC CO., LTD.
Reel/Frame 051179/0338 →
Assignment of Assignor's Interest
Feb 14, 2020
From: YUN, JONG WOOK; JOENG, EUN SUN; HEO, HYE YOUNG; SEO, JANG WON
To: SKC CO., LTD.
Reel/Frame 051826/0403 →
Assignment of Assignor's Interest
Aug 25, 2020
From: YUN, JONG WOOK; JOENG, EUN SUN; SEO, JANG WON
To: SKC CO., LTD.
Reel/Frame 053592/0985 →
Assignment of Assignor's Interest
Oct 22, 2020
From: YUN, JONG WOOK; SEO, JANG WON; HEO, HYEYOUNG; JOENG, EUN SUN
To: SKC CO., LTD.
Reel/Frame 054138/0619 →
Assignment of Assignor's Interest
Oct 22, 2020
From: HEO, HYEYOUNG; YUN, JONG WOOK; KYUN, MYUNG-OK; SEO, JANG WON
To: SKC CO., LTD.
Reel/Frame 054137/0456 →
Assignment of Assignor's Interest
Nov 23, 2020
From: HEO, HYEYOUNG; YUN, SUNGHOON; SEO, JANG WON; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 054444/0461 →
Assignment of Assignor's Interest
Nov 25, 2020
From: AHN, JAEIN; KIM, KYUNG HWAN; YUN, SUNGHOON; HEO, HYEYOUNG
To: SKC CO., LTD.
Reel/Frame 054470/0970 →
Assignment of Assignor's Interest
Mar 23, 2021
From: SKC CO., LTD.
To: SKC SOLMICS CO., LTD.
Reel/Frame 055685/0677 →
Assignment of Assignor's Interest
Jun 16, 2021
From: AHN, JAE IN; KIM, KYUNG HWAN; YUN, SUNG HOON; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 056565/0227 →
Assignment of Assignor's Interest
Jun 16, 2021
From: AHN, JAE IN; KIM, KYUNG HWAN; YUN, SUNG HOON; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 056564/0452 →
Assignment of Assignor's Interest
Aug 11, 2021
From: YUN, JONG WOOK; HEO, HYEYOUNG; AHN, JAEIN; KIM, KYUNG HWAN
To: SKC SOLMICS CO., LTD.
Reel/Frame 057151/0813 →
Assignment of Assignor's Interest
Apr 28, 2022
From: YUN, JONG WOOK; JOENG, EUN SUN; SEO, JANGWON; HEO, HYEYOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059767/0418 →
Assignment of Assignor's Interest
Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →