Patent Assignment
Reel/Frame 055685/0677
Assignment of Assignor's Interest
Recorded: 2021-03-23
Pages: 4
Assignor
SKC CO., LTD.
Executed: 2021-03-02
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Properties
(26)
Composition for Semiconductor Process and Semiconductor Process
Composition for Semiconductor Process and Semiconductor Process
Application:
16/293,453 →
Publication:
US 2019/0276778
Porous Polyurethane Polishing Pad and Process for Preparing a Semiconductor Device by Using the Same
Porous Polyurethane Polishing Pad and Process for Preparing a Semiconductor Device by Using the Same
Porous Polyurethane Polishing Pad and Preparation Method Thereof
Leakage-Proof Polishing Pad and Process for Preparing the Same
Porous Polyurethane Polishing Pad and Process for Preparing the Same
Porous Polishing Pad and Process for Producing the Same
Porous Polyurethane Polishing Pad and Process for Producing the Same
Polishing Pad with Improved Fluidity of Slurry and Process for Preparing Same
Porous Polyurethane Polishing Pad and Method for Manufacturing Same
Polishing Pad and Method for Producing Same
Polishing Pad Having Excellent Airtightness
Polishing Pad Comprising Window Similar in Hardness to Polishing Layer
Composition for a Polishing Pad, Polishing Pad, and Process for Preparing the Same
Composition for Polishing Pad, Polishing Pad and Preparation Method Thereof
Polishing Pad That Minimizes Occurrence of Defects and Process for Preparing the Same
Polishing Pad with Improved Crosslinking Density and Process for Preparing the Same
Composition for Polishing Pad, Polishing Pad and Preparation Method of Semiconductor Device
Polishing Pad with Adjusted Crosslinking Degree and Process for Preparing the Same
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Polishing Pad, Process for Preparing the Same, and Process for Preparing a Semiconductor Device Using the Same
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/077,216 →
Publication:
US 2021/0138605
Composition for Polishing Pad and Polishing Pad
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/101,363 →
Publication:
US 2021/0154797
Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same
Application:
17/104,829 →
Publication:
US 2021/0162560
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 20, 2018
From: AHN, JAEIN; SEO, JANG WON; YUN, SUNGHOON; MOON, SU YOUNG
To: SKC CO., LTD.
Reel/Frame 046148/0975 →
Assignment of Assignor's Interest
Jun 20, 2018
From: AHN, JAEIN; SEO, JANG WON; YUN, SUNGHOON; MOON, SU YOUNG
To: SKC CO., LTD.
Reel/Frame 046148/0784 →
Assignment of Assignor's Interest
Oct 25, 2018
From: YUN, SUNGHOON; SEO, JANG WON; KWON, TAE KYOUNG; AHN, JAEIN
To: SKC CO., LTD.
Reel/Frame 047312/0156 →
Assignment of Assignor's Interest
Oct 26, 2018
From: SEO, JANG WON; HAN, HYUK HEE; HEO, HYE YOUNG; RYOU, JOONSUNG
To: SKC CO., LTD.
Reel/Frame 047329/0755 →
Assignment of Assignor's Interest
Dec 28, 2018
From: SEO, JANG WON; HAN, HYUK HEE; HEO, HYE YOUNG; RYOU, JOONSUNG
To: SKC CO., LTD.
Reel/Frame 047869/0491 →
Assignment of Assignor's Interest
Apr 16, 2019
From: HEO, HYE YOUNG; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 048897/0822 →
Assignment of Assignor's Interest
Apr 19, 2019
From: HEO, HYE YOUNG; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 048942/0303 →
Assignment of Assignor's Interest
Apr 26, 2019
From: YUN, SUNGHOON; SEO, JANG WON; HEO, HYE YOUNG; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 049008/0567 →
Assignment of Assignor's Interest
May 17, 2019
From: HEO, HYE YOUNG; SEO, JANG WON; HAN, HYUK HEE
To: SKC CO., LTD.
Reel/Frame 049216/0015 →
Assignment of Assignor's Interest
Jul 22, 2019
From: RYOU, JOONSUNG; KWON, TAE KYOUNG; SEO, JANG WON; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 049822/0259 →
Assignment of Assignor's Interest
Oct 15, 2019
From: YUN, SUNGHOON; SEO, JANG WON; AHN, JAEIN; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 050722/0769 →
Assignment of Assignor's Interest
Dec 4, 2019
From: YUN, SUNGHOON; RYOU, JOONSUNG; SEO, JANG WON; AHN, JAEIN
To: SKC CO., LTD.
Reel/Frame 051179/0338 →
Assignment of Assignor's Interest
Dec 19, 2019
From: JOENG, EUN SUN; HEO, HYE YOUNG; SEO, JANG WON; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 051336/0454 →
Assignment of Assignor's Interest
Dec 24, 2019
From: JOENG, EUN SUN; HEO, HYE YOUNG; SEO, JANG WON; YUN, JONG WOOK
To: SKC CO., LTD.
Reel/Frame 051363/0835 →
Assignment of Assignor's Interest
Feb 13, 2020
From: YUN, SUNGHOON; HEO, HYE YOUNG; YUN, JONG WOOK; SEO, JANG WON
To: SKC CO., LTD.
Reel/Frame 051815/0771 →
Assignment of Assignor's Interest
Feb 16, 2021
From: KIM, BYOUNGSOO; JIN, GYU AN; OH, JUN ROK
To: SKC CO., LTD.
Reel/Frame 055271/0347 →
Assignment of Assignor's Interest
Feb 17, 2021
From: KIM, BYOUNGSOO; JIN, GYU AN; OH, JUN ROK
To: SKC CO., LTD.
Reel/Frame 055293/0606 →
Change of Name
Feb 13, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 062717/0084 →
Assignment of Assignor's Interest
Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →