Composition for polishing pad, polishing pad and preparation method of semiconductor device
In the composition according to an embodiment, the weight ratio of toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate in the urethane-based prepolymer is adjusted, whereby such physical properties as gelation time can be controlled. Thus, the polishing rate and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled while it has a hardness suitable for a soft pad, whereby it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.
1. A composition, which comprises a urethane-based prepolymer,
wherein the urethane-based prepolymer comprises a prepolymerization reaction product of diisocynate monomers and at least one polyol,
the diisocyanate monomers comprise aromatic diisocyanate monomers,
the aromatic diisocyanate monomers including toluene 2,4-diisocyanate and toluene 2,6-diisocyanate, and
the urethane-based prepolymer comprises toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate at a weight ratio of 100:0 to 100:4.
2. The composition of claim 1 , wherein the urethane-based prepolymer comprises unreacted toluene 2,6-diisocyanate in an amount of 5% by weight or less based on the total weight of the at least one aromatic diisocyanate monomer.
3. The composition of claim 1 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and the unreacted toluene 2,6-diisocyanate at a weight ratio of 100:0 to 100:1.5, and unreacted toluene 2,6-diisocyanate in an amount of 0% by weight to 1.5% by weight based on the total weight of the aromatic diisocyanate monomers.
4. The composition of claim 1 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and toluene 2,4-diisocyanate in which two NCO groups are reacted at a weight ratio of 100:14 to 100:28.
5. The composition of claim 4 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which two NCO groups are reacted in an amount of 10% by weight to 30% by weight based on the total weight of the aromatic diisocyanate monomers.
6. The composition of claim 4 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and the toluene 2,4-diisocyanate in which two NCO groups are reacted at a weight ratio of 100:15 to 100:20, and the toluene 2,4-diisocyanate in which two NCO groups are reacted in an amount of 10% by weight to 15% by weight based on the total weight of the aromatic diisocyanate monomers.
7. The composition of claim 1 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and toluene 2,6-diisocyanate in which one NCO group is reacted in a total amount of 78% by weight to 95% by weight based on the total weight of the aromatic diisocyanate monomers.
8. The composition of claim 7 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted in an amount of 70% by weight to 90% by weight based on the total weight of the aromatic diisocyanate monomers.
9. The composition of claim 7 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and the toluene 2,6-diisocyanate in which one NCO group is reacted in a total amount of 85% by weight to 95% by weight, and the toluene 2,4-diisocyanate in which one NCO group is reacted in an amount of 70% by weight to 75% by weight, based on the total weight of the aromatic diisocyanate monomers.
10. The composition of claim 1 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and toluene 2,6-diisocyanate in which one NCO group is reacted at a weight ratio of 100:1 to 100:23.
11. The composition of claim 10 , wherein the urethane-based prepolymer comprises the toluene 2,6-diisocyanate in which one NCO group is reacted in an amount of 1% by weight to 30% by weight based on the total weight of the aromatic diisocyanate monomers.
12. The composition of claim 10 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and the toluene 2,6-diisocyanate in which one NCO group is reacted at a weight ratio of 100:15 to 100:23, and the toluene 2,6-diisocyanate in which one NCO group is reacted in an amount of 10% by weight to 30% by weight based on the total weight of the aromatic diisocyanate monomers.
13. The composition of claim 1 , wherein the urethane-based prepolymer has an unreacted NCO group content of 5% by weight to 9% by weight based on the weight of the urethane-based prepolymer.
14. The composition of claim 1 , which has a gelation time of 120 seconds to 220 seconds, a hardness of 40 Shore D to 50 Shore D, a tensile strength of 10 N/mm 2 to 25 N/mm 2 , and an elongation of 200% to 350% upon curing.
15. A polishing pad, which comprises a polishing layer, wherein the polishing layer comprises a cured product of a composition comprising a urethane-based prepolymer, a curing agent, and a foaming agent,
the urethane-based prepolymer comprises a prepolymerization reaction product of diisocyanate monomers and at least one polyol, the diisocyanate monomers comprise aromatic diisocyanate monomers, the aromatic diisocyanate monomers including toluene 2,4-diisocyanate and toluene 2,6-diisocyanate, and
the urethane-based prepolymer comprises toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate at a weight ratio of 100:0 to 100:4.
16. The polishing pad of claim 15 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and toluene 2,4-diisocyanate in which two NCO groups are reacted at a weight ratio of 100:14 to 100:28.
17. The polishing pad of claim 15 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and toluene 2,6-diisocyanate in which one NCO group is reacted in a total amount of 78% by weight to 95% by weight based on the total weight of the aromatic diisocyanate monomers.
18. The polishing pad of claim 15 , wherein the urethane-based prepolymer comprises the toluene 2,4-diisocyanate in which one NCO group is reacted and toluene 2,6-diisocyanate in which one NCO group is reacted at a weight ratio of 100:1 to 100:23.
19. The polishing pad of claim 15 , wherein the polishing layer comprises micropores having an average diameter of 20 μm to 25 μm, and the polishing pad has a polishing rate of 1,000 Å/50 seconds to 2,500 Å/50 seconds.
20. A process for preparing a semiconductor device, which comprises polishing the surface of a semiconductor substrate using a polishing pad,
wherein the polishing pad comprises a polishing layer, the polishing layer comprises a cured product of a composition comprising a urethane-based prepolymer, a curing agent, and a foaming agent,
the urethane-based prepolymer comprises a prepolymerization reaction product of diisocyanate monomers and at least one polyol, the diisocyanate monomers comprise aromatic diisocyanate monomers, the aromatic diisocyanate monomers including toluene 2,4-diisocyanate and toluene 2,6-diisocyanate, and
the urethane-based prepolymer comprises toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate at a weight ratio of 100:0 to 100:4.