Patent Assignment
Reel/Frame 052921/0994
Assignment of Assignor's Interest
Recorded: 2020-06-12
Pages: 6
Assignors
JOENG, EUN SUN
Executed: 2020-04-23
YUN, JONG WOOK
Executed: 2020-04-23
HEO, HYE YOUNG
Executed: 2020-04-23
SEO, JANG WON
Executed: 2020-04-23
Assignee
SKC CO., LTD.
84, JANGAN-RO 309BEON-GIL, JANGAN-GU, SUWON-SI, GYEONGGI-DO, 16336, KOREA, REPUBLIC OF
Covered Property
(1)
Composition for Polishing Pad, Polishing Pad and Preparation Method of Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2021
From: SKC CO., LTD.
To: SKC SOLMICS CO., LTD.
Reel/Frame 055685/0677 →
Change of Name
Feb 13, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 062717/0084 →
Assignment of Assignor's Interest
Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →