IP Library › Granted Patent US 12,570,029
Granted Patent B2
US 12,570,029 · App. 18/565,809 · Granted Mar 10, 2026

Method for manufacturing polishing pad window, and polishing pad window manufactured thereby

Inventors: Byung Ju Min (Incheon, KR); Seok Ji Hong (Hwaseong-si, KR); Hak Su Kang (Hwaseong-si, KR); Dae Han Jung (Hwaseong-si, KR); Gi Young Park (Hwaseong-si, KR); Hyun II Jang (Hwaseong-si, KR)
Assignee: KPX CHEMICAL CO., LTD
B29C45/0001B24B37/24B29C45/73B29K2075/00B29K2105/0005B29K2105/0094B29K2995/0088B29K2995/0097B29L2031/736
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Quick Facts
Patent No.
US 12,570,029
App. No.
18/565,809
Granted
Mar 10, 2026
Kind
B2
Abstract

A method for manufacturing a window for a polishing pad is disclosed. The method includes: a) mixing a curing agent with a polyurethane prepolymer having a temperature of 50° C. or higher to less than 100° C. to prepare a mixture; b) injecting the mixture into a mold heated to a temperature of 30° C. or higher to less than 100° C. to a thickness of 5 mm or less; c) demolding a polyurethane cured product from the mold; and d) processing the polyurethane cured product to a thickness of the window of the polishing pad. A polishing pad including the window is also disclosed.

Claims (11)

1 . A method for manufacturing a window for a polishing pad, comprising:

a) mixing a curing agent with a polyurethane prepolymer having a temperature of 50° C. to 70° C. to prepare a mixture;

b) injecting the mixture into a mold heated to a temperature of 30° C. to 60° C. to a thickness of 2 mm to 4 mm;

c) demolding a polyurethane cured product from the mold; and

d) processing the polyurethane cured product to a thickness of the window of the polishing pad.

2 . The method according to claim 1 , wherein the injection of the mixture in step b) into the mold is made to a thickness of 2 mm to 3 mm.

3 . The method according to claim 1 , wherein the polyurethane prepolymer has a weight average molecular weight of 500 to 3000.

4 . The method according to claim 3 , wherein the polyurethane prepolymer is prepared by a polymerization of a composition comprising one or more isocyanate compounds selected from the group consisting of toluene diisocyanate, 4,4′-diphenylmethane diisocyanate, naphthalene-1,5-diisocyanate, toluidine diisocyanate, paraphenylene diisocyanate, xylene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, and cyclohexane diisocyanate; and one or more polyol compounds selected from the group consisting of polyether polyol, polycarbonate polyol, polyester polyol, and polycaprolactone polyol.

5 . The method according to claim 4 , wherein the composition further comprises one or more chain extenders selected from the group consisting of ethylene glycol (EG), 1,2-propylene glycol, 1,3-propylene glycol, 1,2-butanediol, 1,3-butanediol, 2-methyl-1,3-propanediol, 1,4-butanediol (BDO), neopentyl glycol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, diethylene glycol, dipropylene glycol, and tripropylene glycol.

6 . The method according to claim 1 , wherein the curing agent comprises one or more selected from the group consisting of 4,4′-methylene-bis-(2-chloroaniline) (MBOCA), diethyltoluenediamine (DETDA), 3,5-dimethylthio-2,4-toluenediamine and isomers thereof; 3,5-diethyltoluene-2,4-diamine and isomers thereof; 4,4′-bis-(sec-butylamino)-diphenylmethane; 1,4-bis-(sec-butylamino)-benzene; 4,4′-methylene-bis-(2-chloroaniline); 4,4′-methylene-bis-(3-chloro-2,6-diethylaniline) (MCDEA); polytetramethyleneoxide-di-p-aminobenzoate; N,N′-dialkyldiamino diphenyl methane; p,p′-methylene dianiline (MDA); m-phenylenediamine (MPDA); 4,4′-methylene-bis-(2,6-diethylaniline) (MDEA); 4,4′-methylene-bis-(2,3-dichloroaniline) (MDCA); 4,4′-diamino-3,3′-diethyl-5,5′-dimethyl diphenylmethane; 2,2′,3,3′-tetrachloro diamino diphenylmethane; and trimethylene glycol di-p-aminobenzoate.

7 . The method according to claim 1 , wherein the polyurethane prepolymer and the curing agent are mixed in a weight ratio of 9:1 to 7:3 based on a dry weight.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2026
From: KPX CHEMICAL CO., LTD.
To: KPX ELECTROCHEM CO., LTD.
Reel/Frame 074713/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2023
From: MIN, BYUNG JU; HONG, SEOK JI; KANG, HAK SU; JUNG, DAE HAN; PARK, GI YOUNG; JANG, HYUN IL
To: KPX CHEMICAL CO., LTD.
Reel/Frame 065720/0098 →
Priority Claims (1)
KR 10-2022-0008594 · Jan 20, 2022 · national
Continuity (1)
Related Publication 20240367356A1 · Nov 7, 2024
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