Composition for polishing pad, polishing pad and preparation method thereof
In the composition according to the embodiment, the composition of oligomers that constitute the chains in a urethane-based prepolymer may be adjusted to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.
1. A composition, which comprises:
a urethane-based prepolymer, a curing agent, and a foaming agent,
wherein the urethane-based prepolymer comprises a first oligomer represented by the following Formula 1 in which n is 0 or 1; and a second oligomer represented by the following Formula 1 in which n is 2 or 3
2. The composition of claim 1 , wherein the urethane-based prepolymer comprises the first oligomer and the second oligomer at a weight ratio of 1:0.2 to 1:5.
3. The composition of claim 1 , wherein the urethane-based prepolymer further comprises a third oligomer represented by the above Formula 1 in which n is an integer of 4 to 6.
4. The composition of claim 3 , wherein the urethane-based prepolymer comprises the first oligomer, the second oligomer, and the third oligomer at a weight ratio of 1:0.2:0.1 to 1:5:10.
5. The composition of claim 1 , wherein the urethane-based prepolymer further comprises a compound represented by the following Formula 2:
in the above formula, p is an integer of 5 to 30.
6. The composition of claim 1 , wherein the urethane-based prepolymer comprises an unreacted NCO group in an amount of 7% by weight to 10% by weight based on the weight of the urethane-based prepolymer.
7. The composition of claim 1 , wherein the urethane-based prepolymer comprises an unreacted aromatic diisocyanate monomer in an amount of 0.1% by weight to 3% by weight based on the weight of the urethane-based prepolymer.
8. The composition of claim 1 , which has a gelation time of 80 seconds to 130 seconds and has, upon curing, a tensile strength of 10 N/mm 2 to 23 N/mm 2 , an elongation of 80% to 250%, and a hardness of 40 Shore D to 65 Shore D.
9. A process for preparing a composition, which comprises:
preparing a first oligomer represented by the following Formula 1 in which n is 0 or 1;
preparing a second oligomer represented by the following Formula 1 in which n is 2 or 3;
preparing a urethane-based prepolymer comprising the first oligomer and the second oligomer; and
mixing the urethane-based prepolymer, a curing agent, and a foaming agent
10. A process for preparing a polishing pad, which comprises injecting the composition of claim 1 into a mold and curing the composition.
11. A polishing pad, which comprises a polyurethane resin and a plurality of micropores dispersed in the polyurethane resin,
wherein the polyurethane resin is derived from a urethane-based prepolymer, and the urethane-based prepolymer comprises a first oligomer represented by the following Formula 1 in which n is 0 or 1; and a second oligomer represented by the following Formula 1 in which n is 2 or 3.
12. The polishing pad of claim 11 , wherein the micropores have an average size of 21 μm to 25 μm, and the polishing pad has a polishing rate of 3,500 Å/50 seconds to 3,900 Å/50 seconds.
13. A process for preparing a semiconductor device, which comprises polishing the surface of a semiconductor substrate using the polishing pad of claim 11 .