IP Library › Assignment 057151/0813
Patent Assignment
Reel/Frame 057151/0813

Assignment of Assignor's Interest

Recorded: 2021-08-11 Pages: 6
Assignors
YUN, JONG WOOK
Executed: 2021-06-08
HEO, HYEYOUNG
Executed: 2021-06-08
AHN, JAEIN
Executed: 2021-06-08
KIM, KYUNG HWAN
Executed: 2021-06-08
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad and Method for Preparing Semiconductor Device Using the Same
Application: 17/399,849 →
Publication: US 2022/0059401
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 13, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 062717/0084 →
Assignment of Assignor's Interest Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →