Patent Assignment
Reel/Frame 056564/0452
Assignment of Assignor's Interest
Recorded: 2021-06-16
Pages: 7
Assignors
AHN, JAE IN
Executed: 2021-05-12
KIM, KYUNG HWAN
Executed: 2021-05-12
YUN, SUNG HOON
Executed: 2021-05-12
SEO, JANG WON
Executed: 2021-05-12
MYUNG, KANG SIK
Executed: 2021-05-12
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad, Preparation Method Thereof and Method for Preparing Semiconductor Device Using Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.