Assignment of Assignor's Interest

Recorded: 2020-10-22 Pages: 6

Assignors

HEO, HYEYOUNG

Executed: 2020-10-08

YUN, JONG WOOK

Executed: 2020-10-08

KYUN, MYUNG-OK

Executed: 2020-10-08

SEO, JANG WON

Executed: 2020-10-08

Assignee

SKC CO., LTD.

84, JANGAN-RO 309BEON-GIL, JANGAN-GU, SUWON-SI, GYEONGGI-DO, 16336, KOREA, REPUBLIC OF

Covered Property (1)

Polishing Pad, Preparation Method Thereof, and Preparation Method of Semiconductor Device Using Same

Application: 17/077,216 →

Publication: US 2021/0138605

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.