Patent Assignment
Reel/Frame 068419/0247
Assignment of Assignor's Interest
Recorded: 2024-08-28
Pages: 7
Assignors
SHIN, YUJIN
Executed: 2024-08-07
YOON, JONGWOOK
Executed: 2024-08-07
AN, JOONHO
Executed: 2024-08-07
KIM, KYUNGHWAN
Executed: 2024-08-07
SEO, JANGWON
Executed: 2024-08-07
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad with Improved Slurry Flowability and Process for Preparing a Semiconductor Device Using the Same
Application:
18/817,224 →
Publication:
US 2025/0144764
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.