Patent Assignment
Reel/Frame 067765/0495
Assignment of Assignor's Interest
Recorded: 2024-06-19
Pages: 6
Assignors
SHIN, YUJIN
Executed: 2024-04-04
YOON, JONGWOOK
Executed: 2024-04-04
SEO, JANGWON
Executed: 2024-04-04
KIM, KYUNGHWAN
Executed: 2024-04-04
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad with Reduced Defect and Method of Preparing a Semiconductor Device Using the Same
Application:
18/747,451 →
Publication:
US 2025/0033160
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.