IP Library Granted Patent US 12,728,500
Granted Patent B2
US 12,728,500 · App. 18/302,786 · Granted Sep 8, 2026

Conditioning device and method for controlling the conditioning device

Inventors: Jong Wook Yun (Gyeonggi-do, KR); Jang Won Seo (Gyeonggi-do, KR); Su Young Moon (Gyeonggi-do, KR); Kyung Hwan Kim (Gyeonggi-do, KR); Tae Kyoung Kwon (Gyeonggi-do, KR)
Assignee: ENPULSE CO., LTD.
B24B53/017
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Quick Facts
Patent No.
US 12,728,500
App. No.
18/302,786
Granted
Sep 8, 2026
Kind
B2
Abstract

A conditioning device includes: an ejector for ejecting steam to a rotating polishing pad; and an ejector support supporting the ejector. The ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles. The nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles.

Claims (61)

1 . A conditioning device comprising:

an ejector for ejecting steam to a rotating polishing pad;

an ejector support supporting the ejector;

a vertical driver for moving the ejector support in an up-down direction to adjust a vertical separation distance between the polishing pad and the ejector; and

a controller for controlling the vertical driver,

wherein the ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles, and

wherein the nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles,

wherein the controller calculates an angle of ejection pattern of the steam based on an eject pressure of the steam ejected from the plurality of nozzles, determines a target separation distance based on the calculated angle of ejection pattern, and controls the vertical driver to make the target separation distance smaller than a straight line distance, the straight line distance being a distance from an intersection point of a first virtual straight line extending along an inclined portion on one side of a first nozzle of the plurality of nozzles and a second virtual straight line extending along an inclined portion on one side of a second nozzle facing with the one side of the first nozzle to the ejector, and

wherein the second nozzle is disposed adjacent to the first nozzle.

2 . The conditioning device of claim 1 , further comprising a sensor for measuring a temperature of the polishing pad,

wherein the controller further controls the ejector based on a measurement result of the sensor,

wherein the peripheral region is disposed outside the central region in a radial direction of the polishing pad to surround the central region, and

wherein the controller calculates a difference value between a central temperature, which is a temperature of the central region, and a peripheral temperature, which is a temperature of the peripheral region, and when the difference value is greater than a predetermined set value, controls the nozzle heater so that the nozzles disposed to correspond to the peripheral region among the plurality of nozzles are heated to a higher temperature than the nozzles disposed to correspond to the central region among the plurality of nozzles.

3 . The conditioning device of claim 2 , wherein the peripheral region includes:

an inner peripheral region surrounding the central region; and

an outer peripheral region disposed outside the inner peripheral region in the radial direction to surround the inner peripheral region,

wherein the controller calculates a first difference value that is a difference value between the central temperature and a first peripheral temperature which is a temperature of the inner peripheral region, and a second difference value that is a difference value between the central temperature and a second peripheral temperature which is a temperature of the outer peripheral region, and when the first difference value is smaller than the set value and the second difference value is greater than the set value, controls the nozzle heater so that the nozzles disposed to correspond to the outer peripheral area among the plurality of nozzles are heated to a higher temperature than the nozzles disposed to correspond to the inner peripheral region among the plurality of nozzles.

4 . The conditioning device of claim 2 , wherein when the difference value is greater than the set value, the controller determines a heating time corresponding to the difference value and during the determined heating time, controls the nozzle heater so that the nozzles disposed to correspond to the peripheral area among the plurality of nozzles are heated to a higher temperature than the nozzles disposed to correspond to the central region among the plurality of nozzles.

5 . The conditioning device of claim 1 , wherein the plurality of nozzles are arranged spaced apart in a radial direction of the polishing pad,

a steam room for accommodating the steam is formed in the ejector, and

the steam room extends in the radial direction and communicates with the plurality of nozzles.

6 . The conditioning device of claim 5 , further comprising a room heater for heating the steam room to prevent condensation of the steam accommodated in the steam room.

7 . The conditioning device of claim 5 , wherein the steam room is disposed above the plurality of nozzles.

8 . The conditioning device of claim 1 , wherein the ejector extends in a radial direction of the polishing pad, and

the driver further includes a linear driver for moving the ejector in the radial direction with respect to the polishing pad.

9 . A conditioning device comprising:

an ejector for ejecting steam to a rotating polishing pad;

an ejector support supporting the ejector;

a driver including a vertical driver for moving the ejector support in an up-down direction to adjust a vertical separation distance between the polishing pad and the ejector; and

a controller for controlling the driver,

wherein the ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles,

wherein the nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles, and

wherein the controller calculates an angle of ejection pattern of the steam based on an eject pressure of the steam ejected from the plurality of nozzles, determines a target separation distance based on the calculated angle of ejection pattern, and controls the vertical driver so that a vertical separation distance between the plurality of nozzles and an upper surface of the polishing pad becomes the target separation distance.

10 . A method for controlling a conditioning device, comprising:

providing the conditioning device including:

an ejector for ejecting steam to a rotating polishing pad;

an ejector support supporting the ejector;

a vertical driver for moving the ejector support in an up-down direction to adjust a vertical separation distance between the polishing pad and the ejector; and

a controller for controlling the vertical driver,

wherein the ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles, and

wherein the nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles;

calculating an angle of ejection pattern of the steam based on an eject pressure of the steam ejected from the plurality of nozzles to determine a target separation distance based on the calculated angle of ejection pattern;

controlling the vertical driver, by the controller, to make the target separation distance smaller than a straight line distance, the straight line distance being a distance from an intersection point of a first virtual straight line extending along an inclined portion on one side of a first nozzle of the plurality of nozzles and a second virtual straight line extending along an inclined portion on one side of a second nozzle facing with the one side of the first nozzle to the ejector, wherein the second nozzle is disposed adjacent to the first nozzle,

ejecting steam to the rotating polishing pad through the plurality of nozzles; and

heating the plurality of nozzles so that the nozzles disposed to correspond to a peripheral region of the polishing pad among the plurality of nozzles, are heated to a higher temperature than the nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles.

11 . The method of claim 10 , further comprising:

measuring a temperature of the polishing pad; and

calculating a difference value between a central temperature which is a temperature of the central region, and a peripheral temperature which is a temperature of the peripheral region,

wherein in the heating of the plurality of nozzles, when the difference value is greater than a predetermined set value, the nozzles disposed to correspond to the peripheral region of the polishing pad are heated to a higher temperature than the nozzles disposed to correspond to the central region, and

wherein the peripheral region is disposed outside the central region in a radial direction of the polishing pad to surround the central region.

12 . The method of claim 11 , wherein the peripheral region includes an inner peripheral region surrounding the central region, and an outer peripheral region disposed outside the inner peripheral region in the radial direction to surround the inner peripheral region,

wherein the measuring of the temperature of the polishing pad includes:

measuring the central temperature;

measuring a first peripheral temperature which is a temperature of the inner peripheral region; and

measuring a second peripheral temperature which is a temperature of the outer peripheral region,

wherein the calculating of the difference value includes:

calculating a first difference value that is a difference value between the central temperature and the first peripheral temperature; and

calculating a second difference value that is a difference value between the central temperature and the second peripheral temperature, and

wherein in the heating of the plurality of nozzles includes, when the first difference value is smaller than the set value and the second difference value is greater than the set value, the nozzles disposed to correspond to the outer peripheral area among the plurality of nozzles are heated to a higher temperature than the nozzles adjacent to the inner peripheral region among the plurality of nozzles.

13 . The method of claim 11 , further comprising determining a heating time corresponding to the difference value when the difference value is greater than the set value,

wherein the heating of the plurality of nozzles is performed during the determined heating time.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071277/0667 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2023
From: YUN, JONG WOOK; SEO, JANG WON; MOON, SU YOUNG; KIM, KYUNG HWAN; KWON, TAE KYOUNG
To: SK ENPULSE CO., LTD.
Reel/Frame 063368/0185 →
Priority Claims (1)
KR 10-2022-0049069 · Apr 20, 2022 · national
Continuity (1)
Related Publication 20230339072A1 · Oct 26, 2023
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